For power devices such as power MOSFET, power BJT and power diode, the heat sink is very important for providing heat dissipation. From the name itself, it will absorb the heat of the power device and help control the temperature of the safe zone inside the device. For products that rely on air convection cooling or natural cooling, when the power of the power MOSFET is relatively large, the size of the heat sink is also relatively large.
When working, the high-power inverter MOS tube generates a lot of heat. If the heat dissipation effect of the MOS tube is not good, the temperature is too high and it may cause the MOS tube to burn out, which may cause the damage of the entire circuit board. Traditional high-power inverter MOS tube heat dissipation, the high-power inverter MOS tube is set on the circuit board, and the heat sink is also set on the circuit board. The MOS tube is in contact with the heat sink. When the circuit is working, the heat dissipated by the MOS tube is quickly dissipated by the heat sink.
The top of the figure below is the heat sink, and the middle is the heat conductive material, such as thermal conductive silicone grease. The heat conductive material is to allow heat to be more efficiently transferred from the power MOS to the heat sink, so as to dissipate the power MOS with maximum efficiency and reduce its temperature. The bottom is the power MOS, and each temperature point gradually decreases from bottom to top.
MOS heat sink is a device for dissipating heat from heat-prone electronic components in electrical appliances. It is mostly made of aluminum alloy, brass or bronze in the form of plates, sheets, multiple sheets, etc. For example, the CPU central processing unit in the computer needs to use a fairly large heat sink, the power tube, line tube in the TV, and the power amplifier tube in the power amplifier all need to use heat sinks.
The Benefits of Extruded Aluminum Heat Sinks:
Aluminum is a great thermal conductor, which is the main factor while creating heat sinks. In addition to this, it is popular for heat dissipation, high-strength metal heating, and lightweight material. The metal can be squeezed into various shapes of radiation, whether its wide flat heat sinks or oval sinks.
The Corrosion-resistant and rust-free material of aluminum is another reason why aluminum extrusion heatsinks are widely used across industries as it serves along without causing any heating issues.
Copper heat sink has excellent thermal conductivity and electrical conductivity, and is a commonly used chip heat dissipation material. Copper heat sink can quickly transfer the heat of the chip to the surface of the heat sink.
High-pressure bearing and strength are among the qualities of aluminum extruded products. Even in the case of thinness or thickness, aluminum can handle sufficient pressure without getting damaged.
Aluminum is capable to handle various surface treatments with a wide range of designs and colors, making the final product look durable and attractive to be used for different devices.
Aluminum is known for its energy-saving, simple maintenance, and low-cost use. Hence, most companies prefer custom aluminum extrusions for their manufacturing needs.
Types of MOSFETs/Regulators/Transistors Heatsink Mounting
Correct mounting of power semiconductors is crucial for their full functionality. Incorrect mounting can result in thermal and mechanical issues and degraded performance. Also, it is essential to avoid causing mechanical damage to the package.
Screw fixing: This is the most common installation method, and the heat sink is fixed to the MOS tube by screws. This method is firmly installed, but screw holes need to be reserved on the circuit board, and the installation process is relatively complicated. Do not use self - tapping screws.
Clip fixing: Use a clip to clamp the heat sink to the MOS tube, which is convenient and quick to install, and does not require drilling holes on the circuit board. However, the clamping force of the clip is limited, which may affect the heat dissipation effect.
Thermal conductive adhesive pasting: Paste the heat sink to the MOS tube with thermal conductive adhesive, which is simple to install and does not require additional fixings. However, the thermal conductivity of thermal conductive adhesive may not be as good as direct contact with metal, and aging may occur after long-term use.
Hongwei Tech integrates R&D, design, manufacturing and sales, with a group of professional, excellent R&D and cooling solution team. Our Heatsinks are widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc. Just tell us your detailed requirements. The best offer will be provided.
