Customized Aluminum Heatsink | Stamping Heat Sink With Solder Pins
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Customized Aluminum Heatsink | Stamping Heat Sink With Solder Pins
Stamped heat sinks have a major advantage due to their design and size, which is saving board space. Active components are directly screwed or bonded onto the stamped heat sink. Stamped heat sinks are available based on a horizontal or vertical design.
The vertical stamped heatsink design has the advantage to be equipped optionally with solder pins to stabilize in the assembly process and enable the product to be soldered on the board at the same time. Stamping heat sinks are designed for specific electronic package types to ensure optimized fit and function. These heat sinks have a lot of mounting methods, including solder tabs and pins, interference fit with the device throughthese integrated clips or slide-on features, or through the hole hardware like screws and nuts.
For stamped heat sinks, different surfaces, either tin-plated or black anodized, can be chosen to improve heat dissipation and thermal performance for natural convection applications.
The Benefits of Stamping Heat Sinks & Board Level Heatsinks:
The proliferation of new high-performance applications across a wide range of industries, such as communications, industrial, transportation and consumer products, also requires innovative heat removal technologies, as more power is packed into smaller form factors. The stamping board level heatsinks provide for tight integration of the heat sinks, minimize product cost, and enable fast ramp-up to high-volume production.
The High quality, low cost, aluminum stamped heat sinks are ideal for low power thermal management solutions.The simple design and manufacturing of these heat sinks allows high volume manufacturing and reducing assembly costs. Stamped heat sinks are ideally used for TO packages and other power devices.
Features & Benefits
1. Low Cost, economical Stamped Heat Sinks for low power thermal management solutions
2. PCB Mounted Heat Sinks
3. Ideal for use with TO-220 Heat Sinks
4. Standard for TO220s, TO-3s, TO-5s, TO-126s, TO-127s, TO-202s, TO-218s
5. Aluminum anodized material with solderable tabs or aluminum tin plated, copper tin plated
6. Clips, Nuts, or Thermal pad heat sink attachment options available
Stamped heat sinks can have features that clip on to the device so that a screw or secondary clip is not required. Stamped heat sinks have bent/twisted fins to improve the thermal performance in either natural or forced convection.
Aluminum stampings are anodized for improved performance in natural convection. If the heat sink is to be mounted to the PCB, then a solderable tab or pin can be attached to the heat sink.
Types of Board Level heat sinks Installation
1. Using thermal tape or epoxy is a common method usually associated with low power devices and, while not the best thermal interface material, serves its purpose.
2.Pushpins are another common attachment method and require two small holes in the PCB. The push pin, which can be made from plastic or metal, uses the energy of a small spring to provide enough force to keep the heat sink in place.
3. Anchors and wire clips can be used as an alternative. The anchors are either soldered to the PCB using two small holes per anchor or can be installed in a routed slot in the PCB. In the case of the slot, the anchor is installed from the back side of the PCB and is held in place buy the compression force in the anchor design. The advantage of the anchors is that their location is much more flexible and can be moved out of the way of traces in the PCB.
4. A wire clip is a small diameter wire that is bent into various shapes that, when deformed, engages with the anchors and applies a force to the heat sink to hold it in place. The actual shape of the wire clips is dependent upon the location of the anchors, the heat sink design, and the amount of force required. Multiple wire clips can be used with a single heat sink in applications where a higher force is required. Wire clips are removable and allow the heat sink to be reused in the case of a reworked device.
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