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Custom Vapor Chamber Heat Sinks | VC Cooling System

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Custom Vapor Chamber Heat Sinks | VC Cooling System

The principle of Liquid Cold Plate is to form a flow channel in a metal plate, and the electronic components are installed on the surface of the water-cooled plate (with a heat-conducting medium in the middle). The internal coolant enters from the inlet and flows out from the outlet with the heat of the components. While water or water/glycol are the most common fluids used in liquid cooling, gasoline, oil, and refrigerant are other fluids that can be utilized.

  • Brand Name Hongwei
  • Product name Custom Vapor Chamber Heat Sinks
  • Heat Sink Size Based on your requirements.
  • Heatsink Material Aluminum/Copper
  • Hongwei Certificate CE/SGS/ISO/Rohs
  • Heatsink For use Computer ,Inverter, Communication Device, Power Supply Equipment, Electronic Industry, Therm electric Coolers/Generator, IGBT/UPS Cooling Systems, Automobile etc.
  • Heatsink Process CNC,drilling,milling,cutting,stamping,welding,bending,assembling,etc.
  • Surface Treatment Mill finish, Anodizing, Powder coating, nikel plated, Laser carving, paint, etc
  • Heatsink Colors Silver, black, white, bronze, champagne, green, gray, golden yellow, nickel, or customized.
  • Heat Sinks Packing Plastic Tray & Carton, or Customization required
  • Hongwei Services 1. Free sample, Free design; 2. OEM/ODM available; 3. Thermal solution expert support; 4. Excellent pre-sale & after-sale service
The Vapor chamber heat sinks are an innovative thermal management solution designed to efficiently dissipate heat generated by electronic components, particularly in high-performance computing devices such as CPUs and GPUs. The principle behind vapor chamber heat sinks revolves around the use of a sealed chamber containing a small amount of liquid, typically water or other coolants, along with a porous wick structure.

When heat is applied to one area of the vapor chamber, the liquid inside evaporates due to the increased temperature. The vapor then travels to cooler areas within the chamber, where it condenses back into liquid form, releasing the absorbed heat in the process. This cycle continues as long as there is a temperature difference across the vapor chamber, allowing for rapid and uniform heat distribution throughout the chamber.

The key innovation of vapor chamber heat sinks lies in their ability to effectively spread heat over a larger surface area compared to traditional heat sink designs. By utilizing the phase-change properties of the enclosed liquid, vapor chamber heatsinks can transport heat more efficiently, resulting in lower operating temperatures for electronic components.

Furthermore, vapor chamber heat sinks offer greater flexibility in design and integration due to their thin and flat profile, making them suitable for use in compact electronic devices where space is limited. Additionally, advancements in manufacturing techniques have led to the development of vapor chamber heat sinks with customized shapes and sizes, allowing for better compatibility with various hardware configurations and form factors.

vapor chamber heat sinks represent a significant innovation in thermal management technology, offering improved heat dissipation performance, versatility in design, and compatibility with modern electronic devices. Their ability to efficiently transfer heat makes them a preferred choice for applications requiring high-performance cooling solutions.

        

Hongwei Tech integrates R&D, design, manufacturing and sales, with a group of professional, excellent R&D and cooling solution team. Just tell us your detailed requirements. The best offer will be provided.


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