In various types of switching power supplies, MOS transistors, as key power switching devices, generate a lot of heat when working. MOS heat sinks can ensure that MOS tubes work within a stable temperature range and improve the efficiency and reliability of power supplies.
For power devices such as power MOSFET, power BJT and power diode, the heat sink is very important for providing heat dissipation. From the name itself, it will absorb the heat of the power device and help control the temperature of the safe zone inside the device. For products that rely on air convection cooling or natural cooling, when the power of the power MOSFET is relatively large, the size of the heat sink is also relatively large.
When working, the high-power inverter MOS tube generates a lot of heat. If the heat dissipation effect of the MOS tube is not good, the temperature is too high and it may cause the MOS tube to burn out, which may cause the damage of the entire circuit board. Traditional high-power inverter MOS tube heat dissipation, the high-power inverter MOS tube is set on the circuit board, and the heat sink is also set on the circuit board. The MOS tube is in contact with the heat sink. When the circuit is working, the heat dissipated by the MOS tube is quickly dissipated by the heat sink.
The top of the figure below is the heat sink, and the middle is the heat conductive material, such as thermal conductive silicone grease. The heat conductive material is to allow heat to be more efficiently transferred from the power MOS to the heat sink, so as to dissipate the power MOS with maximum efficiency and reduce its temperature. The bottom is the power MOS, and each temperature point gradually decreases from bottom to top.
The Benefits of Stamped Heat Sinks:
Stamped is the process of placing flat sheet metal into a desired form, producing light weighted heat sinks, various ranges of shape and sizes in high productivity. It is widely used in PCB due to its minimal size.
Stamped heat sink offers versatile fin shapes and in various geometries and thickness. This process is a good approach for high efficiency, high ratio and lightweight heat sinks specially in small package sizes.
Materials can be Aluminum (AL1050, AL5052, AL6063) and Copper (C1100) with finishing of Black Anodize or Matte Tin Plated.
High quality, low cost, aluminum stamped heat sinks are ideal for low power thermal management solutions.The simple design and manufacturing of these heat sinks allows high volume manufacturing and reducing assembly costs. Stamped heat sinks are ideally used for TO packages and other power devices.
Features & Benefits of board level
stamped heat sinks:1. Low Cost, economical Stamped Heat Sinks for low power thermal management solutions
2. PCB Mounted Heat Sinks
3. Ideal for use with TO-220 Heat Sinks
4. Standard for TO220s, TO-3s, TO-5s, TO-126s, TO-127s, TO-202s, TO-218s
5. Aluminum anodized material with solderable tabs or aluminum tin plated, copper tin plated
6. Clips, Nuts, or Thermal pad heat sink attachment options available
Types of MOSFETs/Regulators/Transistors Heatsink Mounting
Correct mounting of power semiconductors is crucial for their full functionality. Incorrect mounting can result in thermal and mechanical issues and degraded performance. Also, it is essential to avoid causing mechanical damage to the package.
Screw mounting is recommended, with a rectangular washer inserted between the screw head and the mounting tab. During the mounting process, ensure that the washer does not damage the plastic body of the package. The recommended mounting torque is 0.5 Nm and should not be exceeded. Do not use self - tapping screws.
Clip mounting ensures that force is applied above the silicon die and provides good thermal contact. For heat sinks with a thickness of less than 5 mm, saddle clips are recommended. These clips can provide contact forces ranging from 15 N to 50 N depending on their specifications. For heat sinks with a thickness of more than 5 mm, U - clips should be used, which can also provide contact forces between 15 N and 50 N according to their specifications. There are several proprietary clip solutions where the clip is anchored in a groove of an extruded heatsink, and with these clips, contact forces between 25 N and 50 N can be achieved.
Thermal adhesive pasting: Paste the heat sink to the MOS tube through thermal adhesive, which is simple to install and does not require additional fixings. However, the thermal conductivity of thermal adhesive may not be as good as direct metal contact, and aging may occur after long-term use.
Hongwei Tech integrates R&D, design, manufacturing and sales, with a group of professional, excellent R&D and cooling solution team. Our Board Level Heat Sinks are widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc. Just tell us your detailed requirements. The best offer will be provided.
